RMD-C series semiconductor UV fully enclosed laser marking machine
Product description
RMD-C series semiconductor UV fully enclosed laser marking machine adopts a unique shell design, the 355nm UV laser generator output laser, using a unique low power laser beam on the surface of the product packaging to achieve permanent marking of images, words, numbers, lines. Suitable for ultra-fine marking, special material marking, is the first choice of ultra-fine laser processing high-end market equipment.
Product features
1, high standard and high configuration, stable and reliable operation, water cooling heat dissipation, long time full load operation.
2, unique machine shell, fully enclosed design, prevent laser radiation, to ensure the safety of operators.
3, special small power laser beam, cold processing, the heat affected area is very small, not easy to damage the material.
4, good beam quality, fast response speed, high positioning accuracy, small focusing spot, ultra-fine marking.
5, low energy consumption, no pollution, energy saving and environmental protection, suitable for industrial mass production.
Applicable field
Suitable for all kinds of glass, ceramic, plastic, LCD, semiconductor silicon, IC grain, sapphire, textiles, polymer film materials, as well as cosmetics, medicine, mobile phone, computer accessories, medical equipment, food, polymer materials packaging materials marking.
Technical parameters
Marking samples




金属 塑料 陶瓷 玻璃水晶 高分子材料